(kicad_pcb (version 20171130) (host pcbnew 5.1.4+dfsg1-1)
  (general
    (thickness 1.6)
    (drawings 75)
    (tracks 426)
    (zones 0)
    (modules 36)
    (nets 30)
  )
  (page A4)
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user)
    (49 F.Fab user)
  )
  (setup
    (last_trace_width 0.25)
    (trace_clearance 0.2)
    (zone_clearance 0.508)
    (zone_45_only no)
    (trace_min 0.2)
    (via_size 0.8)
    (via_drill 0.4)
    (via_min_size 0.4)
    (via_min_drill 0.3)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (edge_width 0.05)
    (segment_width 0.2)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.12)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 1.524 1.524)
    (pad_drill 0.762)
    (pad_to_mask_clearance 0.051)
    (solder_mask_min_width 0.25)
    (aux_axis_origin 0 0)
    (visible_elements FFFFFF7F)
    (pcbplotparams
      (layerselection 0x010fc_ffffffff)
      (usegerberextensions false)
      (usegerberattributes false)
      (usegerberadvancedattributes false)
      (creategerberjobfile false)
      (excludeedgelayer true)
      (linewidth 0.150000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory ""))
  )
  (net 0 "")
  (net 1 Board_1-+3V3)
  (net 2 Board_1-/VBUS_SENSE)
  (net 3 Board_1-BAT1+)
  (net 4 Board_1-BAT1_V)
  (net 5 Board_1-BAT2+)
  (net 6 Board_1-BAT2_V)
  (net 7 Board_1-D+)
  (net 8 Board_1-D-)
  (net 9 Board_1-GND)
  (net 10 "Board_1-Net-(D1-Pad2)")
  (net 11 "Board_1-Net-(D2-Pad2)")
  (net 12 "Board_1-Net-(D3-Pad2)")
  (net 13 "Board_1-Net-(D4-Pad2)")
  (net 14 "Board_1-Net-(D5-Pad2)")
  (net 15 "Board_1-Net-(D6-Pad2)")
  (net 16 "Board_1-Net-(J14-Pad1)")
  (net 17 "Board_1-Net-(J16-Pad1)")
  (net 18 "Board_1-Net-(R14-Pad1)")
  (net 19 "Board_1-Net-(R15-Pad1)")
  (net 20 "Board_1-Net-(R16-Pad1)")
  (net 21 "Board_1-Net-(R5-Pad1)")
  (net 22 "Board_1-Net-(R6-Pad1)")
  (net 23 "Board_1-Net-(R7-Pad1)")
  (net 24 Board_1-RST)
  (net 25 Board_1-RX)
  (net 26 Board_1-SWCLK)
  (net 27 Board_1-SWDIO)
  (net 28 Board_1-TX)
  (net 29 Board_1-VBUS)
  (net_class Default "This is the default net class."
    (clearance 0.2)
    (trace_width 0.25)
    (via_dia 0.8)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net Board_1-+3V3)
    (add_net Board_1-/VBUS_SENSE)
    (add_net Board_1-BAT1+)
    (add_net Board_1-BAT1_V)
    (add_net Board_1-BAT2+)
    (add_net Board_1-BAT2_V)
    (add_net Board_1-D+)
    (add_net Board_1-D-)
    (add_net Board_1-GND)
    (add_net "Board_1-Net-(D1-Pad2)")
    (add_net "Board_1-Net-(D2-Pad2)")
    (add_net "Board_1-Net-(D3-Pad2)")
    (add_net "Board_1-Net-(D4-Pad2)")
    (add_net "Board_1-Net-(D5-Pad2)")
    (add_net "Board_1-Net-(D6-Pad2)")
    (add_net "Board_1-Net-(J14-Pad1)")
    (add_net "Board_1-Net-(J16-Pad1)")
    (add_net "Board_1-Net-(R14-Pad1)")
    (add_net "Board_1-Net-(R15-Pad1)")
    (add_net "Board_1-Net-(R16-Pad1)")
    (add_net "Board_1-Net-(R5-Pad1)")
    (add_net "Board_1-Net-(R6-Pad1)")
    (add_net "Board_1-Net-(R7-Pad1)")
    (add_net Board_1-RST)
    (add_net Board_1-RX)
    (add_net Board_1-SWCLK)
    (add_net Board_1-SWDIO)
    (add_net Board_1-TX)
    (add_net Board_1-VBUS)
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBE)
    (at 144 90 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C1 (at 0 1.43 270) (layer B.SilkS) hide)
    (fp_text value 470n (at 0 -1.43 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 9 Board_1-GND))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 1 Board_1-+3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBE)
    (at 145.75 95.75 270)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C2 (at 0 1.43 270) (layer B.SilkS) hide)
    (fp_text value 470n (at 0 -1.43 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 1 smd roundrect (at -0.875 0 270) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 9 Board_1-GND))
    (pad 2 smd roundrect (at 0.875 0 270) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 5 Board_1-BAT2+))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_SMD:LED_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B4B45C9)
    (at 171.25 110.75 180)
    (descr "LED SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "LED handsolder")
    (attr smd)
    (fp_text reference D1 (at 0 -1.43) (layer F.SilkS) hide)
    (fp_text value LED_5V (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 10 "Board_1-Net-(D1-Pad2)"))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 9 Board_1-GND))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_SMD:LED_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B4B45C9)
    (at 171.25 109.25 180)
    (descr "LED SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "LED handsolder")
    (attr smd)
    (fp_text reference D2 (at 0 -1.43) (layer F.SilkS) hide)
    (fp_text value LED_9V (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 11 "Board_1-Net-(D2-Pad2)"))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 9 Board_1-GND))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_SMD:LED_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B4B45C9)
    (at 171.25 107.75 180)
    (descr "LED SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "LED handsolder")
    (attr smd)
    (fp_text reference D3 (at 0 -1.43) (layer F.SilkS) hide)
    (fp_text value LED_12V (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 12 "Board_1-Net-(D3-Pad2)"))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 9 Board_1-GND))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_USB:USB_Micro-B_Wuerth_629105150521_CircularHoles (layer F.Cu) (tedit 5A142044)
    (at 170.25 100.5 90)
    (descr "USB Micro-B receptacle, http://www.mouser.com/ds/2/445/629105150521-469306.pdf")
    (tags "usb micro receptacle")
    (attr smd)
    (fp_text reference J1 (at 0 -3.5 90) (layer F.SilkS) hide)
    (fp_text value "Mirco USB" (at 0 5.6 90) (layer F.Fab))
    (fp_text user %R (at 0 1.05 90) (layer F.Fab))
    (fp_text user "PCB Edge" (at 0 3.75 90) (layer Dwgs.User))
    (pad 1 smd rect (at -1.3 -1.9 90) (size 0.45 1.3) (layers F.Cu F.Paste F.Mask)
      (net 29 Board_1-VBUS))
    (pad 2 smd rect (at -0.65 -1.9 90) (size 0.45 1.3) (layers F.Cu F.Paste F.Mask)
      (net 8 Board_1-D-))
    (pad 3 smd rect (at 0 -1.9 90) (size 0.45 1.3) (layers F.Cu F.Paste F.Mask)
      (net 7 Board_1-D+))
    (pad 4 smd rect (at 0.65 -1.9 90) (size 0.45 1.3) (layers F.Cu F.Paste F.Mask))
    (pad 5 smd rect (at 1.3 -1.9 90) (size 0.45 1.3) (layers F.Cu F.Paste F.Mask)
      (net 9 Board_1-GND))
    (pad 6 thru_hole circle (at -3.725 -1.85 90) (size 2 2) (drill 1.4) (layers *.Cu *.Mask)
      (net 9 Board_1-GND))
    (pad 6 thru_hole circle (at 3.725 -1.85 90) (size 2 2) (drill 1.4) (layers *.Cu *.Mask)
      (net 9 Board_1-GND))
    (pad 6 thru_hole circle (at -3.875 1.95 90) (size 1.8 1.8) (drill 1.2) (layers *.Cu *.Mask)
      (net 9 Board_1-GND))
    (pad 6 thru_hole circle (at 3.875 1.95 90) (size 1.8 1.8) (drill 1.2) (layers *.Cu *.Mask)
      (net 9 Board_1-GND))
    (pad "" np_thru_hole circle (at -2.5 -0.8 90) (size 0.8 0.8) (drill 0.8) (layers *.Cu *.Mask))
    (pad "" np_thru_hole circle (at 2.5 -0.8 90) (size 0.8 0.8) (drill 0.8) (layers *.Cu *.Mask))
    (model ${KISYS3DMOD}/Connector_USB.3dshapes/USB_Micro-B_Wuerth_629105150521_CircularHoles.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x05_P2.54mm_Vertical (layer B.Cu) (tedit 59FED5CC)
    (at 144.42 115.25 270)
    (descr "Through hole straight pin header, 1x05, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x05 2.54mm single row")
    (fp_text reference J7 (at 0 2.33 270) (layer B.SilkS) hide)
    (fp_text value SWD (at 0 -12.49 270) (layer B.Fab))
    (fp_text user %R (at 0 -5.08) (layer B.Fab))
    (pad 1 thru_hole rect (at 0 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 26 Board_1-SWCLK))
    (pad 2 thru_hole oval (at 0 -2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 27 Board_1-SWDIO))
    (pad 3 thru_hole oval (at 0 -5.08 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 24 Board_1-RST))
    (pad 4 thru_hole oval (at 0 -7.62 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 Board_1-+3V3))
    (pad 5 thru_hole oval (at 0 -10.16 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 9 Board_1-GND))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x05_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x03_P2.54mm_Vertical (layer B.Cu) (tedit 59FED5CC)
    (at 149.5 111.25 270)
    (descr "Through hole straight pin header, 1x03, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x03 2.54mm single row")
    (fp_text reference J8 (at 0 2.33 270) (layer B.SilkS) hide)
    (fp_text value UART (at 0 -7.41 270) (layer B.Fab))
    (fp_text user %R (at 0 -2.54) (layer B.Fab))
    (pad 1 thru_hole rect (at 0 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 28 Board_1-TX))
    (pad 2 thru_hole oval (at 0 -2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 25 Board_1-RX))
    (pad 3 thru_hole oval (at 0 -5.08 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 9 Board_1-GND))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x03_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module batteryPack:2mm_Banana-Plug (layer F.Cu) (tedit 5E838C73)
    (at 128 90 90)
    (fp_text reference J13 (at 0 5 90) (layer F.SilkS) hide)
    (fp_text value B1+ (at 0 6.5 90) (layer F.Fab))
    (pad 1 smd rect (at 0 1.75 90) (size 3 3.5) (layers F.Cu F.Paste F.Mask)
      (net 3 Board_1-BAT1+))
  )
  (module batteryPack:2mm_Banana-Plug (layer F.Cu) (tedit 5E838C73)
    (at 128 97 90)
    (fp_text reference J14 (at 0 5 90) (layer F.SilkS) hide)
    (fp_text value B1- (at 0 6.5 90) (layer F.Fab))
    (pad 1 smd rect (at 0 1.75 90) (size 3 3.5) (layers F.Cu F.Paste F.Mask)
      (net 16 "Board_1-Net-(J14-Pad1)"))
  )
  (module batteryPack:2mm_Banana-Plug (layer F.Cu) (tedit 5E838C73)
    (at 128 110 90)
    (fp_text reference J15 (at 0 5 90) (layer F.SilkS) hide)
    (fp_text value B2+ (at 0 6.5 90) (layer F.Fab))
    (pad 1 smd rect (at 0 1.75 90) (size 3 3.5) (layers F.Cu F.Paste F.Mask)
      (net 5 Board_1-BAT2+))
  )
  (module batteryPack:2mm_Banana-Plug (layer F.Cu) (tedit 5E838C73)
    (at 128 103 90)
    (fp_text reference J16 (at 0 5 90) (layer F.SilkS) hide)
    (fp_text value B2- (at 0 6.5 90) (layer F.Fab))
    (pad 1 smd rect (at 0 1.75 90) (size 3 3.5) (layers F.Cu F.Paste F.Mask)
      (net 17 "Board_1-Net-(J16-Pad1)"))
  )
  (module batteryPack:USB_C_Female-16Pin-HPJF (layer F.Cu) (tedit 5E845E78)
    (at 167.25 89.25 90)
    (fp_text reference P1 (at 0 9 90) (layer F.SilkS) hide)
    (fp_text value USB-C (at 0 -2 90) (layer F.Fab))
    (pad A6 smd rect (at -0.25 0 90) (size 0.3 2) (layers F.Cu F.Paste F.Mask)
      (net 7 Board_1-D+))
    (pad A7 smd rect (at 0.25 0 90) (size 0.3 2) (layers F.Cu F.Paste F.Mask)
      (net 8 Board_1-D-))
    (pad B7 smd rect (at -0.75 0 90) (size 0.3 2) (layers F.Cu F.Paste F.Mask)
      (net 8 Board_1-D-))
    (pad B6 smd rect (at 0.75 0 90) (size 0.3 2) (layers F.Cu F.Paste F.Mask)
      (net 7 Board_1-D+))
    (pad A5 smd rect (at -1.25 0 90) (size 0.3 2) (layers F.Cu F.Paste F.Mask))
    (pad A8 smd rect (at 1.25 0 90) (size 0.3 2) (layers F.Cu F.Paste F.Mask))
    (pad B8 smd rect (at -1.75 0 90) (size 0.3 2) (layers F.Cu F.Paste F.Mask))
    (pad B5 smd rect (at 1.75 0 90) (size 0.3 2) (layers F.Cu F.Paste F.Mask))
    (pad S1 thru_hole oval (at -4.32 1 90) (size 1 2.1) (drill oval 0.6 1.7) (layers *.Cu *.Mask)
      (net 9 Board_1-GND))
    (pad S1 thru_hole oval (at 4.32 1 90) (size 1 2.1) (drill oval 0.6 1.7) (layers *.Cu *.Mask)
      (net 9 Board_1-GND))
    (pad S1 thru_hole oval (at -4.25 4.75 90) (size 1 1.8) (drill oval 0.6 1.4) (layers *.Cu *.Mask)
      (net 9 Board_1-GND))
    (pad S1 thru_hole oval (at 4.32 4.75 90) (size 1 1.8) (drill oval 0.6 1.4) (layers *.Cu *.Mask)
      (net 9 Board_1-GND))
    (pad "" np_thru_hole circle (at -2.89 1.5 180) (size 0.7 0.7) (drill 0.7) (layers *.Cu *.Mask))
    (pad "" np_thru_hole circle (at 2.89 1.5 180) (size 0.7 0.7) (drill 0.7) (layers *.Cu *.Mask))
    (pad A1 smd rect (at -3.35 0 90) (size 0.3 2) (layers F.Cu F.Paste F.Mask)
      (net 9 Board_1-GND))
    (pad B12 smd rect (at -3.05 0 90) (size 0.3 2) (layers F.Cu F.Paste F.Mask)
      (net 9 Board_1-GND))
    (pad A4 smd rect (at -2.55 0 90) (size 0.3 2) (layers F.Cu F.Paste F.Mask)
      (net 29 Board_1-VBUS))
    (pad B9 smd rect (at -2.25 0 90) (size 0.3 2) (layers F.Cu F.Paste F.Mask)
      (net 29 Board_1-VBUS))
    (pad B4 smd rect (at 2.25 0 90) (size 0.3 2) (layers F.Cu F.Paste F.Mask)
      (net 29 Board_1-VBUS))
    (pad A9 smd rect (at 2.55 0 90) (size 0.3 2) (layers F.Cu F.Paste F.Mask)
      (net 29 Board_1-VBUS))
    (pad B1 smd rect (at 3.05 0 90) (size 0.3 2) (layers F.Cu F.Paste F.Mask)
      (net 9 Board_1-GND))
    (pad A12 smd rect (at 3.35 0 90) (size 0.3 2) (layers F.Cu F.Paste F.Mask)
      (net 9 Board_1-GND))
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBD)
    (at 140.5 91.75 270)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R1 (at 0 1.43 270) (layer B.SilkS) hide)
    (fp_text value 10k (at 0 -1.43 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 1 smd roundrect (at -0.875 0 270) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 1 Board_1-+3V3))
    (pad 2 smd roundrect (at 0.875 0 270) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 8 Board_1-D-))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBD)
    (at 142.25 91.75 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R2 (at 0 1.43 -90) (layer B.SilkS) hide)
    (fp_text value 2k4 (at 0 -1.43 -90) (layer B.Fab))
    (fp_text user %R (at 0 0 -90) (layer B.Fab))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 8 Board_1-D-))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 9 Board_1-GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBD)
    (at 154.25 93.25 270)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R3 (at 0 1.43 270) (layer B.SilkS) hide)
    (fp_text value 10k (at 0 -1.43 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 1 smd roundrect (at -0.875 0 270) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 1 Board_1-+3V3))
    (pad 2 smd roundrect (at 0.875 0 270) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 7 Board_1-D+))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBD)
    (at 156 93.25 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R4 (at 0 1.43 270) (layer B.SilkS) hide)
    (fp_text value 2k4 (at 0 -1.43 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 7 Board_1-D+))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 9 Board_1-GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBD)
    (at 167.75 110.75)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R5 (at 0 1.43) (layer B.SilkS) hide)
    (fp_text value 1k (at 0 -1.43) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 21 "Board_1-Net-(R5-Pad1)"))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 10 "Board_1-Net-(D1-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBD)
    (at 167.75 109.25)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R6 (at 0 1.43) (layer B.SilkS) hide)
    (fp_text value 1k (at 0 -1.43) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 22 "Board_1-Net-(R6-Pad1)"))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 11 "Board_1-Net-(D2-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBD)
    (at 167.75 107.75)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R7 (at 0 1.43) (layer B.SilkS) hide)
    (fp_text value 1k (at 0 -1.43) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 23 "Board_1-Net-(R7-Pad1)"))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 12 "Board_1-Net-(D3-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBD)
    (at 154.25 89.5 270)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R8 (at 0 1.43 270) (layer B.SilkS) hide)
    (fp_text value 62k (at 0 -1.43 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 1 smd roundrect (at -0.875 0 270) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 29 Board_1-VBUS))
    (pad 2 smd roundrect (at 0.875 0 270) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 2 Board_1-/VBUS_SENSE))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBD)
    (at 156 89.5 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R9 (at 0 1.43 270) (layer B.SilkS) hide)
    (fp_text value 10k (at 0 -1.43 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 2 Board_1-/VBUS_SENSE))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 9 Board_1-GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_SO:TSSOP-20_4.4x6.5mm_P0.65mm (layer B.Cu) (tedit 5E476F32)
    (at 148.75 90 180)
    (descr "TSSOP, 20 Pin (JEDEC MO-153 Var AC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_gullwing_generator.py")
    (tags "TSSOP SO")
    (attr smd)
    (fp_text reference U2 (at 0 4.2) (layer B.SilkS) hide)
    (fp_text value STM32F030F4Px (at 0 -4.2) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 1 smd roundrect (at -2.8625 2.925 180) (size 1.475 0.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 9 Board_1-GND))
    (pad 2 smd roundrect (at -2.8625 2.275 180) (size 1.475 0.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 20 "Board_1-Net-(R16-Pad1)"))
    (pad 3 smd roundrect (at -2.8625 1.625 180) (size 1.475 0.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 19 "Board_1-Net-(R15-Pad1)"))
    (pad 4 smd roundrect (at -2.8625 0.975 180) (size 1.475 0.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 24 Board_1-RST))
    (pad 5 smd roundrect (at -2.8625 0.325 180) (size 1.475 0.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 1 Board_1-+3V3))
    (pad 6 smd roundrect (at -2.8625 -0.325 180) (size 1.475 0.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 2 Board_1-/VBUS_SENSE))
    (pad 7 smd roundrect (at -2.8625 -0.975 180) (size 1.475 0.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 4 Board_1-BAT1_V))
    (pad 8 smd roundrect (at -2.8625 -1.625 180) (size 1.475 0.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 28 Board_1-TX))
    (pad 9 smd roundrect (at -2.8625 -2.275 180) (size 1.475 0.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 25 Board_1-RX))
    (pad 10 smd roundrect (at -2.8625 -2.925 180) (size 1.475 0.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 7 Board_1-D+))
    (pad 11 smd roundrect (at 2.8625 -2.925 180) (size 1.475 0.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 8 Board_1-D-))
    (pad 12 smd roundrect (at 2.8625 -2.275 180) (size 1.475 0.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 6 Board_1-BAT2_V))
    (pad 13 smd roundrect (at 2.8625 -1.625 180) (size 1.475 0.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 21 "Board_1-Net-(R5-Pad1)"))
    (pad 14 smd roundrect (at 2.8625 -0.975 180) (size 1.475 0.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 18 "Board_1-Net-(R14-Pad1)"))
    (pad 15 smd roundrect (at 2.8625 -0.325 180) (size 1.475 0.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 9 Board_1-GND))
    (pad 16 smd roundrect (at 2.8625 0.325 180) (size 1.475 0.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 1 Board_1-+3V3))
    (pad 17 smd roundrect (at 2.8625 0.975 180) (size 1.475 0.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 22 "Board_1-Net-(R6-Pad1)"))
    (pad 18 smd roundrect (at 2.8625 1.625 180) (size 1.475 0.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 23 "Board_1-Net-(R7-Pad1)"))
    (pad 19 smd roundrect (at 2.8625 2.275 180) (size 1.475 0.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 27 Board_1-SWDIO))
    (pad 20 smd roundrect (at 2.8625 2.925 180) (size 1.475 0.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 26 Board_1-SWCLK))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/TSSOP-20_4.4x6.5mm_P0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module batteryPack:TP5100-Module locked (layer F.Cu) (tedit 5E85BF28)
    (at 148.5 91 180)
    (fp_text reference U1 (at 0 12) (layer F.SilkS) hide)
    (fp_text value TP5100-Module (at 0 -10) (layer F.Fab))
    (fp_text user GND (at -12 -9.75) (layer F.SilkS) hide)
    (fp_text user BAT- (at 12.25 -9.75) (layer F.SilkS) hide)
    (fp_text user VCC (at -12 10) (layer F.SilkS) hide)
    (fp_text user BAT+ (at 12 10) (layer F.SilkS) hide)
    (pad 1 smd rect (at -11 -7 180) (size 5 2) (drill (offset -1.5 0)) (layers F.Cu F.Paste F.Mask)
      (net 9 Board_1-GND))
    (pad 2 smd rect (at -11 7 180) (size 5 2) (drill (offset -1.5 0)) (layers F.Cu F.Paste F.Mask)
      (net 29 Board_1-VBUS))
    (pad 3 smd rect (at 11 7) (size 5 2) (drill (offset -1.5 0)) (layers F.Cu F.Paste F.Mask)
      (net 3 Board_1-BAT1+))
    (pad 4 smd rect (at 11 -7) (size 5 2) (drill (offset -1.5 0)) (layers F.Cu F.Paste F.Mask)
      (net 16 "Board_1-Net-(J14-Pad1)"))
    (pad 5 smd rect (at -10.5 -2 180) (size 5.5 1.5) (drill (offset -2 0)) (layers F.Cu F.Paste F.Mask))
    (pad 6 smd rect (at -10.5 -4.5 180) (size 5.5 1.5) (drill (offset -2 0)) (layers F.Cu F.Paste F.Mask))
    (pad 7 smd rect (at -10.5 0.5 180) (size 5.5 1.5) (drill (offset -2 0)) (layers F.Cu F.Paste F.Mask))
  )
  (module batteryPack:TP5100-Module locked (layer F.Cu) (tedit 5E85BF28)
    (at 148.5 109.25 180)
    (fp_text reference U4 (at 0 12) (layer F.SilkS) hide)
    (fp_text value TP5100-Module (at 0 -10) (layer F.Fab))
    (fp_text user GND (at -12 -9.75) (layer F.SilkS) hide)
    (fp_text user BAT- (at 12.25 -9.75) (layer F.SilkS) hide)
    (fp_text user VCC (at -12 10) (layer F.SilkS) hide)
    (fp_text user BAT+ (at 12 10) (layer F.SilkS) hide)
    (pad 1 smd rect (at -11 -7 180) (size 5 2) (drill (offset -1.5 0)) (layers F.Cu F.Paste F.Mask)
      (net 9 Board_1-GND))
    (pad 2 smd rect (at -11 7 180) (size 5 2) (drill (offset -1.5 0)) (layers F.Cu F.Paste F.Mask)
      (net 29 Board_1-VBUS))
    (pad 3 smd rect (at 11 7) (size 5 2) (drill (offset -1.5 0)) (layers F.Cu F.Paste F.Mask)
      (net 5 Board_1-BAT2+))
    (pad 4 smd rect (at 11 -7) (size 5 2) (drill (offset -1.5 0)) (layers F.Cu F.Paste F.Mask)
      (net 17 "Board_1-Net-(J16-Pad1)"))
    (pad 5 smd rect (at -10.5 -2 180) (size 5.5 1.5) (drill (offset -2 0)) (layers F.Cu F.Paste F.Mask))
    (pad 6 smd rect (at -10.5 -4.5 180) (size 5.5 1.5) (drill (offset -2 0)) (layers F.Cu F.Paste F.Mask))
    (pad 7 smd rect (at -10.5 0.5 180) (size 5.5 1.5) (drill (offset -2 0)) (layers F.Cu F.Paste F.Mask))
  )
  (module LED_SMD:LED_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B4B45C9)
    (at 171.25 112.25 180)
    (descr "LED SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "LED handsolder")
    (attr smd)
    (fp_text reference D4 (at 0 -1.43) (layer F.SilkS) hide)
    (fp_text value LED_40% (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 9 Board_1-GND))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 13 "Board_1-Net-(D4-Pad2)"))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_SMD:LED_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B4B45C9)
    (at 171.25 113.75 180)
    (descr "LED SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "LED handsolder")
    (attr smd)
    (fp_text reference D5 (at 0 -1.43) (layer F.SilkS) hide)
    (fp_text value LED_20% (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 9 Board_1-GND))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 14 "Board_1-Net-(D5-Pad2)"))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_SMD:LED_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B4B45C9)
    (at 171.25 115.25 180)
    (descr "LED SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "LED handsolder")
    (attr smd)
    (fp_text reference D6 (at 0 -1.43) (layer F.SilkS) hide)
    (fp_text value LED_0% (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 9 Board_1-GND))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 15 "Board_1-Net-(D6-Pad2)"))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBD)
    (at 143.85 99.65 270)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R10 (at 0 1.43 90) (layer B.SilkS) hide)
    (fp_text value 10k (at 0 -1.43 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 1 smd roundrect (at -0.875 0 270) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 5 Board_1-BAT2+))
    (pad 2 smd roundrect (at 0.875 0 270) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 6 Board_1-BAT2_V))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBD)
    (at 145.55 99.65 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R11 (at 0 1.43 90) (layer B.SilkS) hide)
    (fp_text value 20k (at 0 -1.43 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 6 Board_1-BAT2_V))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 9 Board_1-GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBD)
    (at 141.55 83.95)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R12 (at 0 1.43) (layer B.SilkS) hide)
    (fp_text value 10k (at 0 -1.43) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 3 Board_1-BAT1+))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 4 Board_1-BAT1_V))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBD)
    (at 145.25 83.95)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R13 (at 0 1.43) (layer B.SilkS) hide)
    (fp_text value 20k (at 0 -1.43) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 4 Board_1-BAT1_V))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 9 Board_1-GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBD)
    (at 167.75 112.25)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R14 (at 0 1.43) (layer B.SilkS) hide)
    (fp_text value 1k (at 0 -1.43) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 18 "Board_1-Net-(R14-Pad1)"))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 13 "Board_1-Net-(D4-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBD)
    (at 167.75 113.75)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R15 (at 0 1.43) (layer B.SilkS) hide)
    (fp_text value 1k (at 0 -1.43) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 19 "Board_1-Net-(R15-Pad1)"))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 14 "Board_1-Net-(D5-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBD)
    (at 167.75 115.25)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R16 (at 0 1.43) (layer B.SilkS) hide)
    (fp_text value 1k (at 0 -1.43) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 20 "Board_1-Net-(R16-Pad1)"))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 15 "Board_1-Net-(D6-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-23 (layer B.Cu) (tedit 5A02FF57)
    (at 148.5 96 270)
    (descr "SOT-23, Standard")
    (tags SOT-23)
    (attr smd)
    (fp_text reference U3 (at 0 2.5 90) (layer B.SilkS) hide)
    (fp_text value XC6206P332MR (at 0 -2.5 90) (layer B.Fab))
    (fp_text user %R (at 0 0 180) (layer B.Fab))
    (pad 1 smd rect (at -1 0.95 270) (size 0.9 0.8) (layers B.Cu B.Paste B.Mask)
      (net 9 Board_1-GND))
    (pad 2 smd rect (at -1 -0.95 270) (size 0.9 0.8) (layers B.Cu B.Paste B.Mask)
      (net 1 Board_1-+3V3))
    (pad 3 smd rect (at 1 0 270) (size 0.9 0.8) (layers B.Cu B.Paste B.Mask)
      (net 5 Board_1-BAT2+))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
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  (gr_line (start 172.8139 118.078) (end 172.6184 118.153) (layer Edge.Cuts) (width 0.1))
  (gr_line (start 173.0005 117.9829) (end 172.8139 118.078) (layer Edge.Cuts) (width 0.1))
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  (gr_line (start 128.3812 82.8238) (end 128.5129 82.6611) (layer Edge.Cuts) (width 0.1))
  (gr_line (start 128.2671 82.9995) (end 128.3812 82.8238) (layer Edge.Cuts) (width 0.1))
  (gr_line (start 128.172 83.1861) (end 128.2671 82.9995) (layer Edge.Cuts) (width 0.1))
  (gr_line (start 128.097 83.3816) (end 128.172 83.1861) (layer Edge.Cuts) (width 0.1))
  (gr_line (start 128.0427 83.584) (end 128.097 83.3816) (layer Edge.Cuts) (width 0.1))
  (gr_line (start 128.01 83.7909) (end 128.0427 83.584) (layer Edge.Cuts) (width 0.1))
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  (gr_line (start 127.999 116.25) (end 127.999 84) (layer Edge.Cuts) (width 0.1))
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  (gr_line (start 128.3812 117.4262) (end 128.2671 117.2505) (layer Edge.Cuts) (width 0.1))
  (gr_line (start 128.513 117.589) (end 128.3812 117.4262) (layer Edge.Cuts) (width 0.1))
  (gr_line (start 128.6611 117.7371) (end 128.513 117.589) (layer Edge.Cuts) (width 0.1))
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  (gr_line (start 172.2091 118.24) (end 172 118.251) (layer Edge.Cuts) (width 0.1))
  (gr_text "GND\n3V3\nRST\nIO\nCLK" (at 149.5 109.5 270) (layer B.SilkS))
  (gr_text "GND\nRX\nTX" (at 152.25 104.75 270) (layer B.SilkS))
  (gr_text "github.com/RoboticsBrno/\nRB0002-BatteryPack\nCC BY-SA 4.0" (at 135.709 100.037 270) (layer B.SilkS))
  (gr_text "12V\n9V\n5V\n" (at 168.05 109.45) (layer F.SilkS))
  (gr_text 100% (at 171.05 106.25) (layer F.SilkS))
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  (gr_text _ (at 131.45 102.75 90) (layer F.SilkS))
  (gr_text + (at 132.7 90 90) (layer F.SilkS))
  (gr_text + (at 132.95 110 90) (layer F.SilkS))
  (gr_text "RB0002 Battery Pack\nCharger\n v1.0 06/2020" (at 161.49 99.91 270) (layer B.SilkS))
  (zone (net 29) (net_name Board_1-VBUS) (layer F.Cu) (hatch edge 0.508)
    (priority 3)
    (connect_pads yes (clearance 0.2))
    (min_thickness 0.2)
    (fill yes (arc_segments 32) (thermal_gap 0) (thermal_bridge_width 0.5) (smoothing fillet) (radius 1))
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      )
    )
  )
  (zone (net 29) (net_name Board_1-VBUS) (layer F.Cu) (hatch edge 0.508)
    (priority 4)
    (connect_pads yes (clearance 0.2))
    (min_thickness 0.2)
    (fill yes (arc_segments 32) (thermal_gap 0) (thermal_bridge_width 0.5) (smoothing fillet) (radius 2))
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      )
    )
  )
  (zone (net 9) (net_name Board_1-GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads yes (clearance 0.5))
    (min_thickness 0.2)
    (fill yes (arc_segments 32) (thermal_gap 0) (thermal_bridge_width 0.5) (smoothing fillet) (radius 1))
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      )
    )
  )
  (zone (net 9) (net_name Board_1-GND) (layer B.Cu) (hatch edge 0.508)
    (priority 3)
    (connect_pads yes (clearance 0.5))
    (min_thickness 0.2)
    (fill yes (arc_segments 32) (thermal_gap 0) (thermal_bridge_width 0.5) (smoothing fillet) (radius 1))
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      (pts
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    )
  )
)
